linuxfind-windows延缓写入失败怎么办
2023年3月30日发(作者：xp虚拟机)
a
t
i
m
e
a
n
d
Al
l
t
hi
n
g
s
i
n
t
h
ei
r
b
ei
n
g
a
r
e
g
o
o
d
f
o
r
s
o
IPC标准清单
No.英文名称
1
IPC-T-50GTermsandDefinitionforInterconnectingandPackaging
ElectronicCircuits
2
IPC-TM-650TestMethodsManual
3
IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&Electronic
Assemblies
4
IPC/EIAJ-STD-002BSolderabilityTestsforComponentLeads,
Terminations,Lugs,TerminalsandWires
5
IPC/EIAJ-STD-003ASolderabilityTestsforPrintedBoards
6
IPC/EIAJ-STD-004ARequirementsforSolderingFluxes
7
IPC/EIAJ-STD-005ARequirementsforSolderingPastes
8
IPC-A-610DAcceptabilityofElectronicAssemblies
9
IPC-A-600FAcceptabilityofPrintedBoards
10
IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseof
Moisture/ReflowSensitiveSurfaceMountDevices
11
IPC-7711/21A
12
IPC-9701PerformanceTestMethodsandQualificationRequirements
forSurfaceMountSolderAttachments
13
IPC-CC-830BQualificationandPerformanceofElectricalInsulating
CompoundforPrintedWiringAssemblies
14
IPC-7525StencilDesignGuidelines
15
IPC-7351GeneralReqirementsforSurfaceMountDesignandLand
PatternStanderd
16
IPC/WHMA-A-620RequirementsandAcceptanceforCableandWire
HarnessAssemblies
17
IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBalls
18
IPC-M-108CleaningGuidesandHandbookManual
19
IPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards
20
IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:What
DoesItTellUs?
21
IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies
22
IPC-SC-60APostSolderSolventCleaningHandbook
23
IPC-SA-61APostSolderSemi-aqueousCleaningHandbook
24
IPC-AC-62AAqueousPostSolderCleaningHandbook
25
IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailures
inPrintedCircuitAssemblies
26
IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--
LowSolids,FluxesandPastesProcessedinAmbientAir
27
IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting
28
IPC-9201SurfaceInsulationResistanceHandbook
29
IPC-M-109ComponentHandlingManual
30
IPC-DRM-18GComponentIdentificationDeskReferenceManual
31
IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDesk
ReferenceManual
32
IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReference
Manual
33
IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurface
MountAttachments
34
IPC-PD-335ElectronicPackagingHandbook
35
IPC-QL365ACertificationofFacilitiesThatInspect/TestPrinted
Boards,ComponentsandMaterials
36
IPC-MI-660IncomingInspectionofRawMaterialsManual
37
IPC-HDBK-005GuidetoSolderPasteAssessment
38
IPC-HDBK-830GuidelineforDesign,SelectionandApplicationof
ConformalCoatings
39
IPC-7530GuidelinesforTemperatureProfilingforMassSoldering
(Reflow&Wave)Processes
40
IPC-TP-1115SelectionandImplementationStrategyforaLow-
ResidueNo-CleanProcess
41
IPC-S-816SMTProcessGuideline&Checklist
42
IPC-CM-770EComponentMountingGuidelinesforPrintedBoards
43
IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT
44
IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurface
MountPlacementEquipmentStandardization
45
•4IPC-9850PlacementAccuracyVerificationPanels
46
•1IPC-9850CMMMeasurementVerificationPanels
47
•150IPC-9850QFP-100GlassComponents
48
•130IPC-9850QFP-208GlassComponents
49
•150IPC-9850BGA-228GlassComponents
50
•NISTTraceableMeasurementCertificate
51
•CustomStorageCase
52
IPC-TR-464AcceleratedAgingforSolderabilityEvaluations
53
SMC-WP-001SolderingCapabilityWhitePaperReport
54
SMC-WP-005PCBSurfaceFinishes
IPC:AssociationConnectingElectronicsIndustries(电子制造协会),从TheInstituteofPrintedCir
InstituteoftheInterconnectingandPackingElectronicCircuit”(电子电路互连与封装协会)逐步发展衍
a
t
i
m
e
a
n
d
Al
l
t
hi
n
g
s
i
n
t
h
ei
r
b
ei
n
g
a
r
e
g
o
o
d
f
o
r
s
o
中文名称
电子电路互连与封装的定义和术语
试验方法手册
电气与电子组装件锡焊要求
元件引线、端子、焊片、接线柱及导线可焊性试验
印制板可焊性试验
助焊剂需求
焊膏需求
印制板组装件验收条件
印制板验收条件
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
电子组装件的返工与返修
表面安装锡焊件性能试验方法与鉴定要求
印制板组装电气绝缘性能和质量手册
网版设计导则
表面安装器件和焊盘图形标准通用要求
电缆和引线贴装的要求和验收
BGA球形凸点的标准规范
清洗导则和手册
非密集型印制板清洁应用导则
电路板离子洁净度测量：它告诉我们什么？
印制板及组装件清洗导则
锡焊后溶剂清洗手册
锡焊后半水溶剂清洗手册
锡焊后水溶液清洗手册
电化学迁移：印制电路组件的电气诱发故障
IPC第3阶段非清洗助焊剂研究
深入离子洁净度测试
表面绝缘电阻手册
元件处理手册
零件分类标识手册
接插件焊接点评价手册
接插件焊接点评价手册
表面安装焊接件加速可靠性试验导则
电子封装手册
标准清单
印制板,元件和材料检验/试验企业的授证
原材料接收检验手册
焊膏性能评价手册
敷形涂层的设计，选择和应用手册
大规模焊接(回流焊与波峰焊)过程温度曲线指南
低残留不清洗工艺的选择和实施
表面安装技术过程导则及检核表
印制板元件安装导则
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
表面贴装设备性能测试用的标准工具包
可焊性加速老化评价(附修订)
可焊性工艺导论
印制电路板表面清洗电子组装的IPC标准列表
子制造协会),从TheInstituteofPrintedCirciut(印制电路板协会),The
rcuit”(电子电路互连与封装协会)逐步发展衍变而来.
IPC标准清单
No.英文名称
1
IPC-T-50GTermsandDefinitionforInterconnectingandPackaging
ElectronicCircuits
2
IPC-TM-650TestMethodsManual
3
IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&Electronic
Assemblies
4
IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-
001—IncludesAmendment1
5
IPC-A-610DAcceptabilityofElectronicAssemblies
6
IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-
610BtoCComparison
7
IPC-EA-100-KElectronicAssemblyReferenceSet
8
IPC/WHMA-A-620RequirementsandAcceptanceforCableandWire
HarnessAssemblies
9
IPC/EIAJ-STD-012ImplementationofFlipChipandChipScale
Technology
10
IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation
11
IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChip
Applications
12
J-STD-027MechanicalOutlineStandardforFlipChipandChipSize
Configurations
13
IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlip
ChipandChipScaleBumps
14
J-STD-013ImplementationofBallGridArrayandOtherHighDensity
Technology
15
IPC-7095DesignandAssemblyProcessImplementationforBGAs
16
IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBalls
17
IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization
18
IPC-M-108CleaningGuidesandHandbookManual
19
IPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards
20
IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:What
DoesItTellUs?
21
IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies
22
IPC-SC-60APostSolderSolventCleaningHandbook
23
IPC-SA-61APostSolderSemi-aqueousCleaningHandbook
24
IPC-AC-62AAqueousPostSolderCleaningHandbook
25
IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailures
inPrintedCircuitAssemblies
26
IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--
LowSolids,FluxesandPastesProcessedinAmbientAir
27
IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting
28
IPC-9201SurfaceInsulationResistanceHandbook
29
IPC-TP-104-KCleaning&CleanlinessTestProgram,Phase3Water
SolubleFluxes,
30
IPC-M-109ComponentHandlingManual
31
IPC/JEDECJ-STD-020CMoisture/ReflowSensitivityClassificationfor
NonhermeticSolidStateSurfaceMountDevices
32
IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseof
Moisture/ReflowSensitiveSurfaceMountDevices
33
IPC/JEDECJ-STD-035AcousticMicroscopyforNon-Hermetic
EncapsulatedElectronicComponents
34
IPC-DRM-18GComponentIdentificationDeskReferenceManual
35
IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDesk
ReferenceManual
36
IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReference
Manual
37
IPC-DRM-56WirePreparation&CrimpingDeskReferenceManual
38
IPC-DRM-53IntroductiontoElectronicsAssemblyDeskReference
Manual
39
IPC-M-103StandardsforSurfaceMountAssembliesManual
40
IPC-M-104StandardsforPrintedBoardAssemblyManual
41
IPC-TA-722TechnologyAssessmentofSoldering
42
IPC-TA-723TechnologyAssessmentHandbookonSurfaceMounting
43
IPC-TA-724TechnologyAssessmentSeriesonCleanRooms
44
IPC-SM-780ComponentPackagingandInterconnectingwith
EmphasisonSurfaceMounting
45
IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurface
MountAttachments
46
IPC-9701PerformanceTestMethodsandQualificationRequirements
forSurfaceMountSolderAttachments
47
IPC/JEDEC-9702MonotonicBendCharacterizationofBoard-Level
Interconnects
48
IPC-PD-335ElectronicPackagingHandbook
49
IPC-7525StencilDesignGuidelines
50
IPC-QL365ACertificationofFacilitiesThatInspect/TestPrinted
Boards,ComponentsandMaterials
51
IPC-9191GeneralGuidelinesforImplementationofStatisticalProcess
Control
52
IPC-TR-581IPCPhaseIIIControlledAtmosphereSolderingStudy
53
IPC-MI-660IncomingInspectionofRawMaterialsManual
54
IPC/EIAJ-STD-004ARequirementsforSolderingFluxes-Includes
Amendment1
55
IPC/EIAJ-STD-005RequirementsforSolderingPastes-Includes
Amendment1
56
IPC-HDBK-005GuidetoSolderPasteAssessment
57
IPC/EIAJ-STD-006ARequirementsforElectronicGradeSolder
AlloysandFluxedandNon-FluxedSolidSolders电子设备用电子级
锡焊合金、带焊剂及不带剂整体焊料技术要求
58
IPC-SM-817GeneralRequirementsforDielectricSurfaceMounting
Adhesives
59
ELEC-SOLDERModernSolderTechnologyforCompetitiveElectronics
Manufacturing
60
IPC-WP-006RoundRobinTesting&Analysis:Lead-FreeAlloys-Tin,
Silver,&Copper
61
IPC-CA-821GeneralRequirementsforThermallyConductive
Adhesives
62
IPC-3406GuidelinesforElectricallyConductiveSurfaceMount
Adhesives
63
IPC-3408GeneralRequirementsforAnisotropicallyConductive
AdhesivesFilms
64
IPC-CC-830BQualificationandPerformanceofElectricalInsulating
CompoundforPrintedWiringAssemblies
65
IPC-HDBK-830GuidelineforDesign,SelectionandApplicationof
ConformalCoatings
66
IPC-SM-840CQualificationandPerformanceofPermanentSolder
Mask-IncludesAmendment1
67
IPC-HDBK-840GuidetoSolderPasteAssessment
68
ELEC-MICROHandbookofLeadFreeSolderTechnologyfor
MicroelectronicAssemblies
69
IPC-TP-1114TheLayman’sGuidetoQualifyingaProcesstoJ-STD-
001
70
IPC-AJ-820Assembly&JoiningHandbook
71
IPC-7530GuidelinesforTemperatureProfilingforMassSoldering
(Reflow&Wave)Processes
72
IPC-TP-1090TheLayman’sGuidetoQualifyingNewFluxes
73
IPC-TP-1115SelectionandImplementationStrategyforaLow-
ResidueNo-CleanProcess
74
IPC-S-816SMTProcessGuideline&Checklist
75
IPC-TR-460ATrouble-ShootingChecklistforWaveSolderingPrinted
WiringBoards
76
IPC-CM-770EComponentMountingGuidelinesforPrintedBoards
77
IPC-7912ACalculationofDPMO&ManufacturingIndicesforPrinted
BoardAssemblies
78
IPC-9261In-ProcessDPMOandEstimatedYieldforPWAs
79
IPC-DPMO-202IPC-7912/9261EndItemandInProcessDPMOSet
80
IPC-9500-KAssemblyProcessComponentSimulations,Guidelines&
ClassificationsPackage
81
IPC-9501PWBAssemblyProcessSimulationforEvaluationof
ElectronicComponents
82
IPC-9502PWBAssemblySolderingProcessGuidelineforElectronic
Components
83
IPC-9503MoistureSensitivityClassificationforNon-ICComponents
84
IPC-9504AssemblyProcessSimulationforEvaluationofNon-IC
Components(PreconditioningNon-ICComponents)
85
IPC-9850-KSurfaceMountPlacementEquipmentCharacterization-KIT
86
IPC-9850-TM-KW,IPC-9850-TM-KTestMaterialsKitforSurface
MountPlacementEquipmentStandardization
87
•4IPC-9850PlacementAccuracyVerificationPanels
88
•1IPC-9850CMMMeasurementVerificationPanels
89
•150IPC-9850QFP-100GlassComponents
90
•130IPC-9850QFP-208GlassComponents
91
•150IPC-9850BGA-228GlassComponents
92
•NISTTraceableMeasurementCertificate
93
•CustomStorageCase
94
IPC-7711/21A
95
IPC/EIAJ-STD-002BSolderabilityTestsforComponentLeads,
Terminations,Lugs,TerminalsandWires
96
IPC/EIAJ-STD-003ASolderabilityTestsforPrintedBoards
97
IPC-TR-461Trouble-ShootingChecklistforWaveSolderingPrinted
WiringBoards
98
IPC-TR-462SolderabilityEvaluationofPrintedBoardswithProtective
CoatingsOverLong-termStorage
99
IPC-TR-464AcceleratedAgingforSolderabilityEvaluations
100
IPC-TR-465-1RoundRobinTestonSteamAgerTemperatureControl
Stability
101
IPC-TR-465-2TheEffectofSteamAgingTimeandTemperatureon
SolderabilityTestResults
102
IPC-TR-465-3EvaluationofSteamAgingonAlternativeFinishes,
PhaseIIA
103
IPC-TR-466TechnicalReport:WettingBalanceStandardWeight
ComparisonTest
104
SMC-WP-001SolderingCapabilityWhitePaperReport
105
SMC-WP-005PCBSurfaceFinishes
IPC:AssociationConnectingElectronicsIndustries(电子制造协会),从TheInstituteofPrintedCir
InstituteoftheInterconnectingandPackingElectronicCircuit”(电子电路互连与封装协会)逐步发展衍
中文名称
电子电路互连与封装的定义和术语
试验方法手册
电气与电子组装件锡焊要求
J-STD-001辅助手册及指南及修改说明1
印制板组装件验收条件
IPC-610手册和指南(包括IPC-A-610B和C的对比)
电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-HDBK-001，IPC-A-
610C。
电缆和引线贴装的要求和验收
倒装芯片及芯片级封装技术的应用
芯片直装技术实施导则
倒装芯片用半导体设计标准
FC（倒装片）和CSP(芯片级封装)的外形轮廓标准
倒装芯片及芯片级凸块结构的性能标准
球栅阵列(BGA)及其它高密度封装技术的应用
球栅阵列的设计与组装过程的实施
BGA球形凸点的标准规范
多芯片组件技术应用导则
清洗导则和手册
非密集型印制板清洁应用导则
电路板离子洁净度测量：它告诉我们什么？
印制板及组装件清洗导则
锡焊后溶剂清洗手册
锡焊后半水溶剂清洗手册
锡焊后水溶液清洗手册
电化学迁移：印制电路组件的电气诱发故障
IPC第3阶段非清洗助焊剂研究
深入离子洁净度测试
表面绝缘电阻手册
Part1&Part2第3阶段水溶性助焊剂清洗，第一和第二部分
元件处理手册
非密封固态表面贴装器件湿度／再流焊敏感度分类
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
标准清单
非气密封装电子元件用声波显微镜
零件分类标识手册
接插件焊接点评价手册
接插件焊接点评价手册
导线和端子预成形参考手册
电子组装基础介绍手册
所有SMT标准合订本
10种常用印制板组装标准合订本
锡焊技术精选手册
表面安装技术精选手册
清洁室技术精选系列
以表面安装为主的元件封装及互连导则
表面安装焊接件加速可靠性试验导则
表面安装锡焊件性能试验方法与鉴定要求
平板互连的单一弯曲特性
电子封装手册
网版设计导则
印制板,元件和材料检验/试验企业的授证
统计过程控制导则
IPC第3阶段受控气氛焊接研究
原材料接收检验手册
锡焊焊剂要求（包括修改单1）
焊膏技术要求（包括修改单1）
焊膏性能评价手册
表面安装用介电粘接剂通用要求
电子制造的最新焊接技术
无铅焊料合金锡-银-铜的试验和分析求
导热胶粘剂通用要求
表面贴装导电胶使用指南
各向异性导电胶膜的一般要求
印制板组装电气绝缘性能和质量手册
敷形涂层的设计，选择和应用手册
永久性阻焊剂的鉴定及性能(包括修改单1)
焊膏性能评价手册
微电子组装无铅焊接技术手册
基于J-STD-001组装工艺雷氏选择法
装联手册
大规模焊接(回流焊与波峰焊)过程温度曲线指南
新型助焊剂雷氏选择法
低残留不清洗工艺的选择和实施
表面安装技术过程导则及检核表
印制板波峰焊故障排除检查表
印制板元件安装导则
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-7912A和IPC-9261合订本
组装过程中元件仿真,规则分类
电子元件的印制板组装过程模拟评价
电子元件的印制板组装焊接过导则
非集成电路元件的湿度敏感度分级
非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
表面贴装设备性能测试用的标准工具包
电子组装件的返工与返修
元件引线、端子、焊片、接线柱及导线可焊性试验
印制板可焊性试验
印制板波峰焊故障排除检查表
带保护性涂层印制板长期贮存的可焊性评价
可焊性加速老化评价(附修订)
蒸汽老化器温度控制稳定性联合试验
蒸汽老化时间与温度对可焊性试验结果的影响
替代涂覆层的蒸汽老化评价
技术报告:润湿天平称重标准对比测试
可焊性工艺导论
印制电路板表面清洗电子组装的IPC标准列表
子制造协会),从TheInstituteofPrintedCirciut(印制电路板协会),The
rcuit”(电子电路互连与封装协会)逐步发展衍变而来.
更多推荐
steam101
发布评论